PRODUCT
for BCE type IGZO TFTs
New molybdenum alloyfor BCE type IGZO TFTs
reduced Ag redeposition during anode patterning process
New wet etchant solution for Ag reduced Ag redeposition during anode patterning process
New molybdenum alloy for tri-layer
New molybdenum alloyNew molybdenum alloy for tri-layer
better performance and chemical stability
New p-type metal-oxide semiconductorbetter performance and chemical stability
less than 100℃ for 30min
Low temperature liquid annealingless than 100℃ for 30min
ABOUT US
Cuprum Materials
New molybdenum alloy for Mo alloy/Cu/Mo alloy (Test sample available)
• Customer: Sputtering target company, Display company
New molybdenum alloy for BCE type IGZO TFTs (Test sample available)
• Customer: Sputtering target company, Display company
Novel wet annealing for flexible IGZO TFTs (Test available)
•Customer: Display company, Annealing equipment company
Enhanced Ag etchant (in R&D )
• Wet process chemical company, TFT/OLED company
New p-type metal oxide semiconductor (in R&D)
•TFT/Memory company
