Our Ru electroplating solution is designed for next-generation semiconductor metallization.
It provides uniform ruthenium deposition, excellent electrical performance, and high process reliability for advanced semiconductor manufacturing.
Key Features
✔ Uniform Ru Deposition
✔ Excellent Adhesion
✔ Superior Corrosion Resistance
✔ High Electrical Conductivity
✔ Low Surface Roughness
✔ High Process Stability
✔ Compatible with Advanced Packaging
