PRODUCT
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Ru Electroplating solution TGV
Comparison of trench cross-sections : Conventional technology
(using ruthenium sulfate, sulfamic acid, and thio compounds) Vs Cuprum ruthenium plating solution.
Optical images show that the proposed film has flawless quality without any surface cracks or pits compared to conventional methods.
SEM cross-sections verify that the proposed solution perfectly fills nano trenches without internal voids or seams.
