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TGV 구리 도금액
New molybdenum alloy for tri-layer
Issue : Pure molybdenum is not suitable for copper tri-layer structure in thin film transistors (Mo/Cu/Mo)
Solution : New molybdenum alloy for Tri-copper metallization structure(US Registered Patent)
Requirements for copper tri-layer metallization
Pure molybdenum and pure titanium for upper layer produce a “tip” or “overhung” upper layer, which results in Coverage defects in TFTs.
Requires new molybdenum alloys and new titanium alloys
Mo alloy/Cu/Mo alloy Tri-layer in F- ion free Cu Hydrogen peroxide etchant
Upper tip in molybdenum
No tip in new molybdenum alloy
