PRODUCT
Cuprum promise to always do our best.
Ni alloy Electroplating solution for Probe Tips
Cuprum's Ni alloy electroplating solution is engineered for semiconductor probe tips,
providing excellent hardness, wear resistance, and stable electrical contact performance.
It is designed to improve probe durability and measurement reliability in advanced semiconductor testing.
Key Features
✔ High Hardness & Wear Resistance
✔ Low Electrical Resistivity (6.78 μΩ·cm)
✔ Extraordinary Yield Stress (1,046 MPa)
✔ Stable Electrical Contact Performance
✔ Long Probe Lifetime
✔ Reliable Measurement Performance
electrical resistivity : 6.78 μΩ·cm
extraordinary yield stress : 1,046 MPa
Certified with a world-class electrical resistivity of 6.78 μΩ·cm and
an extraordinary yield stress of 1,046 MPa, our Ni-Cu alloy provides extreme durability for high-performance probe beams.