PRODUCT

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Pd-Co Electroplating solution Probe Tips

Cuprum's Pd-Co electroplating solution is developed for high-performance probe tip coatings, 

offering a dense Pd-Co/Cu multilayer structure with strong corrosion resistance and stable contact resistance. 

It is optimized to protect probe tips from oxidation and wear during repeated wafer testing.



Key Features
✔ Dense, Uniform Pd-Co/Cu Multilayer Structure
✔ Excellent Corrosion Resistance
✔ Strong Chemisorption to Active Sites (ΔG°ads = -44.8 kJ/mol)
✔ Stable, Reproducible Layer Thickness
✔ Low Contact Resistance
✔ Extended Probe Lifetime4-5Cu Echant

Pd-Co/Cu multilayer structure fabricated

using a commercial electroplating solution

Pd-Co/Cu multilayer structure fabricated

using a commercial electroplating solution

Cuprum's Pd-Co plating solution enables the formation of an exceptionally uniform multilayer structure

The calculated 𝚫𝑮_𝒂𝒅𝒔^∘   value was determined to be -44.8 kJ/mol.

Generally, a value lower (more negative) than -40 kJ/mol indicates that chemisorption => Strong binding to active sites