Cuprum's Cu etchant solution is formulated for precise, anisotropic etching of copper in advanced semiconductor packaging processes.
The proprietary additive forms a stable protective complex on the Cu sidewalls, suppressing lateral dissolution and enabling clean, well-defined etch profiles.
Key Features
✔ Anisotropic (Sidewall-Selective) Etching
✔ Strong Chemisorption on Cu Surface
✔ Stable Cu-Additive Complex Layer
✔ Suppressed Sidewall Dissolution
✔ High-Precision, Reproducible Etch Profiles
