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PRODUCT

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Cu Echant

Mechanism

The surface coverage (θ) on the copper increases with the additive concentration.


The adsorption free energy (ΔG_ads^∘) is lower (more negative) than -40 kJ/mole.

(The formula in the graph shows a value of around -68.64 kJ/mol.)


=> Strong chemisorption rather than simple physical adsorption

<XSP Without additive>

<XSP With additive>

  • Significant increase in the green peak upon adding the additive.
  • Proves the formation of a stable complex layer on Cu sidewalls.
  • Prevents Cu dissolution, enabling successful anisotropic etching.

Result

Ultimately, Cuprum's etchant demonstrated an outstanding etch factor of over 53.

OM Image

(x200)

Company A additive

Cuprum Additive 1

Cuprum Additive 2

E/F

24.97

12.55

33

Conditions

Agitation Rate

Temperature

Thickness

Pattern Size

Sample Information

2500rpm

50℃

20㎛

50x5

YMT