PRODUCT
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Cu Electroplating solution for TGV
Selectivity of Copper Electroplating
The normal process causes excessive top copper overburden (73 µm), which leads to over plating and high CMP load.
The Cuprum B process increases selectivity, reducing the top layer to 33 µm while keeping the via fully filled.
TGV electroplatingAR 8:1 (Only DC plating)
The Cuprum additive exhibits a higher filling ratio than JGB
Deep via filling enabled by the interaction of the Cuprum additive
