Plating Solution 

for High-hardness Probe Pins

Probe cards are equipped with probe pins, such as cantilever-type or vertical-type pins, for testing.

In probe cards used for semiconductor integrated circuit conduction testing, probe pins are made from various materials due to differing performance requirements based on their purpose, such as mechanical properties like hardness and flexibility, and electrical properties like resistivity. During testing, deformation can occur, necessitating regular maintenance of probe pins in testing equipment. However, adopting high-hardness probe pins coated with ruthenium plating is expected to reduce deformation caused by wear, extend the lifespan of semiconductor testing equipment, and contribute to cost reduction.

Heat Dissipation Substrate

With the rapid advancement of cutting-edge technology, electronic components are becoming smaller, more integrated, and multifunctional, making heat management technology a critical issue. The deterioration of electronic components caused by heat generation can lead to severe problems such as reduced reliability and shortened lifespan. Thus, dissipating heat to maintain temperatures below a certain threshold is essential.

In particular, high-power modules, which generate significant heat at high operating temperatures, are prone to malfunctions and failures due to heat. This highlights the critical role of copper heat dissipation substrates, which not only rapidly release heat from power modules to the outside but also offer high durability against thermal stress caused by repetitive temperature cycles between high operating temperatures and room temperature.